Dynamic recrystallization behavior and microstructure evolution of high-performance Cu–3.28Ni–0.6Si–0.22Zn–0.11Cr–0.04P during hot compression

Abstract

By means of isothermal compression at temperatures in the range of 650–900 °C and strain rates in the range of 0.001–1 s−1, the dynamic recrystallization behavior and microstructural evolution of a Cu–3.28Ni–0.6Si–0.22Zn–0.11Cr–0.04P (wt%) alloy designed by a machine learning method were investigated. A semiempirical constitutive equation, processing maps and an average activation energy were generated. The microstructure under different conditions and the effect of strain rate on the texture of the alloy at 800–900 °C were observed. The results show that the suitable temperature is 800–900 °C; when the strain is less than 0.4, the appropriate strain rate is 0.01–0.5 s−1; and when the strain is greater than 0.4, the appropriate strain rate is below 0.05 s−1. After deformation at 800 °C, the main texture changed from {112}〈111〉 of copper to a uniform distribution with the increase in strain rate, but the sample did not have obvious texture after deformation at 850 and 900 °C. The above results can provide a reference for the selection of process parameters.