Abstract
Dynamic compact thermal model plays important roles in predicting the junction temperature and characterizing the transient thermal behavior of an electronic device. In this paper, analytical dynamic compact thermal model for high power LEDs is established based on the three-directional heat flow paths under junction-to-ambient definition. Comparative results with finite element method model indicate that the presented model is accurate and efficient. It is further reduced by analyzing the influence of different components of the LED package. Good agreement with experimental results confirms that the reduced analytical model can predict the junction temperature and characterize the thermal behavior effectively.
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