Abstract
The goal of this research is to optimize a static and dynamic compact thermal model for a ball grid array (BGA) package using experimental data. The general objectives of thermal modeling are to increase the accuracy of electrical analysis to enhance the performance of the electronic systems. The project is focused on generating the static and dynamic compact thermal model of a Bipolar Junction Transistor (BJT) and a Ball Grid Array (BGA) based on experimental results of infrared (IR) camera system , so that the steady state and transient thermal behaviors of the package could be predicted fast with required accuracy. The approach proposed by a previous study based on generation of dynamic compact thermal model of a BGA package using simulation tools, is extended in this work to generate the static and dynamic compact model of the same package represented by a RC (thermal) network or admittance matrix based upon a methodology which couples different layers of experimental data to the error minimization notion of the problem. This optimization problem sets the temperature profile experimental data as a standard and compares the compact model's computed temperature and refines itself with a feedback, until reaching a desired point.
Highlights
More component density in electronic boards, more speed of VLSI circuits and unwillingly more power dissipation of fast electronic devices seem to be bundled together
The DELPHI procedure of generating static compact thermal model has several steps as following: 1- A detailed thermal model of the package is generated by a thermal CAD tool. 2- Using the thermal CAD tool, thermal simulations are performed on package for a set of boundary conditions proposed by DELPHI consortium and average temperatures and heat fluxes of desired locations are obtained. 3- A network is postulated
3.3.1 ThermaCam Researcher Software When the implementation was accomplished in either mode of Instruction and with Quartus II or Verilog codes, the “ThermaCam Researcher” (Researcher) and the “Software Development Kit” (SDK) were applied as the dedicated softwares related to the IR camera system to record and to track the temperature profile of the Ball Grid Array (BGA)
Summary
The input data required to obtain a methodology to generate the static & dynamic compact thermal model under two/several applied boundary conditions are reported along with the simultaneous current/power measurements required for developing these compact models. Parallel measurements and calculations regarding the power (consumption, generated) of the BGA (see figure 5.1) are described. The thermal analysis and measurements are both performed by the infrared (IR) camera system’s Researcher software and SDK. Similar to the 4th Chapter, first the static compact thermal model of the BGA is obtained, followed by the dynamic compact thermal model generation. The methodology to generate the compact thermal models is described for applied experimental boundary conditions based on the number of different maximum currents or different experiments to assess the performance of this methodology
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