Abstract
The microstructures and failure mechanisms of a sintered silicon nitride, tested under dynamic and static fatigue conditions, were studied. For longer test times at 1000°C, all specimens showed a slow crack growth mechanism of failure, with failure generally initiating at a defect. Even more importantly, these specimens contained cracks in addition to the failure fracture which extended into the material surrounding the initiation site. The cracking always appeared to occur within an amorphous grain‐boundary phase.
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