Dynamic analysis of wiresaw slicing brittle crystals

Abstract

In the past few years, wire sawing was developed quickly and became the promising brittle crystals slicing technology because of its advantages of processing large wafers of very small thickness, high surface quality, high yield, and ability to slice brittle crystals made of various materials. In the process, the thin wire, the processing tools, travels at high speed, and subjects to external excitation from many aspects. Dynamic effect is directly related to processing result, in this paper the dynamic effect of wiresaw in cutting region is studied, a suitable model can be present according to continuous gyroscopic system character. Research on wire oscillation form variation with the change of cutting depth; obtain the steady state response of wire with different process parameters on wire saw manufacturing process, and a better understanding of the wire saw operation can be developed. The effect the final surface finish of wafers is analyzed to improve the process quality.