Abstract
Abstract This paper explores the “IEC standard 60529 International Protection Marking” also sometimes referenced as Ingress Protection Marking and how it applies to mobile and wearable electronics on a component level. The testing methodology used for an OCQFN (Open Cavity Quad Flatpack No-lead) humidity sensor will be evaluated including pass/fail criteria. The applicability of this standard has been developed to verify the robustness of finished mechanical assemblies intended to be put in static mounted applications but in this case has been adopted to verify the robustness of a semiconductor based sensor at a packaging level with accelerated pre-conditioning to predict the end of life performance.
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