Abstract
The importance of ductile regime cutting has been emphasized in the production of large-diameter optics and semiconductor substrates over the last ten years. However, the available technology has not yet been implemented in industry. The reason is that cutting technology based on the motion-copying principle is too sensitive for error motions of a machine tool to maintain a stable actual depth of cut below the critical depth. A new cutting technology using a flying tool under negative pressure has been developed. In this technology, a flying tool glides over a workpiece surface while maintaining a small constant height, like a negative-pressure slider of a magnetic disc drive. Using the tool system, ductile regime cutting of optical glass and monocrystalline silicon was examined, and a mirror-surface finish with no cracks was achieved on a face lathe having a 0.1 μm order of error motion.
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