Ductile Regime Cutting of Brittle Materials Using a Flying Tool under Negative Pressure

Abstract

The importance of ductile regime cutting has been emphasized in the production of large-diameter optics and semiconductor substrates over the last ten years. However the available technology has not yet been implemented in industry. The reason is that cutting technology based on the motion-copying principle is too sensitive for error motions of a machine tool to maintain the actual depth of cut stably below the critical depth. A new cutting technology using a flying tool under negative pressure has been developed. In this technology, a flying tool glides over a workpiece surface while maintaining a small height like a negative-pressure slider of a magnetic disc drive. Using the tool system, ductile regime cutting of optical glass and monocrystalline silicon was examined, and a mirror-surface finish with no cracks was achieved on a face lathe having a 0.1μm order of error motion.