Dual mechanisms in hydrogen reduction of copper oxide: surface reaction and subsurface oxygen atom transfer.

Abstract

The study of the reduction of copper oxide (CuO) by hydrogen (H2) is helpful in elucidating the reduction mechanism of oxygen carriers. In this study, the reduction mechanism of CuO by H2 and the process of oxygen atom transfer were investigated through the density functional theory (DFT) method and thermodynamic calculation. DFT calculation results showed that during the reaction between H2 and the surface of CuO, Cu underwent a Cu2+ → Cu1+ → Cu0 transformation, the Cu-O bond (-IpCOHP = 2.41) of the Cu2O phase was more stable than that (-IpCOHP = 1.94) of the CuO phase, and the reduction of Cu2O by H2 was more difficult than the reduction of CuO. As the surface oxygen vacancy concentration increased, it was more likely that the subsurface O atoms transfer to the surface at zero H2 coverage (no H2 molecule on the surface), allowing the surface to maintain a stable Cu2O phase. However, when the H2 coverage was 0.25 monolayer (ML) (one H2 molecule every four surface Cu atoms), the presence of H atoms on the surface made the upward transfer of O atoms from the subsurface more difficult. The rate of consuming surface O atoms in the reduction reaction was greater than the rate of subsurface O atom transfer induced by the reduction reaction and the surface Cu2O phase could not be maintained stably. Through thermodynamic analysis, at high H2 concentration, the reaction between H2 and CuO was more likely to generate Cu, while at low H2 concentration, it was more likely to generate Cu2O. In summary, the valence state of Cu in the reaction process between CuO and H2 depended on the concentration of H2.