Dual‐Interface Competitive Fracture Model for Curvature‐Based Transfer Printing Method

Abstract

AbstractTransfer printing is a key technology in the fabrication of flexible electronics. Transfer printing method based on curvature provides a simple and effective way to transfer films onto weakly adhesive or even adhesiveless surfaces, overcoming the shortage of traditional transfer printing methods that it is difficult to print functional materials from strong interface to weak interface and can only be applicable to surfaces with certain interfacial strength. So far, the theoretical principle of the curvature‐based transfer printing method has not yet been developed. In this article, a dual‐interface competitive fracture model is established to analyze the mechanism of printing and picking up processes and quantitatively provide the critical transfer printing radius in terms of material and geometric properties of the transfer printing system. This model is verified to be both correct and widely applicable by rich experimental results, providing a new and reliable theory for the fabrication of inorganic flexible electronics.