Abstract

We demonstrate the direct transfer of graphene from Cu foil to rigid and flexible substrates, such as glass and PET, using as an intermediate layer a thin film of polyimide (PI) mixed with an aminosilane (3-aminopropyltrimethoxysilane) or only PI, respectively. While the dry removal of graphene by an adhesive has been previously demonstrated—being removed from graphite by scotch tape or from a Cu foil by thick epoxy (~20 µm) on Si—our work is the first step towards making a substrate ready for device fabrication using the polymer-free technique. Our approach leads to an article that is transparent, thermally stable—up to 350 °C—and free of polymer residues on the device side of the graphene, which is contrary to the case of the standard wet-transfer process using PMMA. Also, in addition to previous novelty, our technique is fast and easier by using current industrial technology—a hot press and a laminator—with Cu recycling by its mechanical peel-off; it provides high interfacial stability in aqueous media and it is not restricted to a specific material—polyimide and polyamic acids can be used. All the previous reasons demonstrate a feasible process that enables device fabrication.

Highlights

  • Introduction ptGraphene, a two-dimensional monolayer of sp2-bonded carbon atoms, has been attracting great interest following its isolation by the mechanical cleavage of graphite [1]

  • Our work is based on a specific polyimide – VTEC – we provide initial results using polyamic acid (PAA), demonstrating that our technique is not limited to an only specific material

  • PI films were deposited on Cu/graphene following the procedure described in ref. [26], and were characterized at different curing temperatures (Tc)

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Summary

Introduction

Introduction ptGraphene, a two-dimensional monolayer of sp2-bonded carbon atoms, has been attracting great interest following its isolation by the mechanical cleavage of graphite [1]. SEM and AFM images of graphene transferred samples in figure 2 highlight the importance ce of the surface morphology of the Cu foil used in the process.

Results
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