Abstract

Summary form only given: increasing short channel effects like drain induced barrier lowering (DIBL) and V<;sub>;T<;/sub>; roll-off are serious impediments to further scaling of conventional MOSFET. These limitations instigated all researchers to look for innovative devices. Non-scalable sub-threshold swing in MOSFET limits its application in high speed and low power application. Tunnel FET is a strong candidate in high speed and low power application because of its potential to get low Sub-Threshold swing (<;60 mv/dec). In the previous work it was demonstrated that silicon double gate tunnel FET (DGTFET) suffers from unacceptable low ON-current. Here we have shown that, by introducing the δ<;sub>;p<;/sub>;<;sup>;+<;/sup>; layer high ON-current (I<;sub>;ON<;/sub>;), low OFF-current (I<;sub>;OFF<;/sub>;) and very low subthreshold swing can be obtained in DGTFET. Schematic device structure is depicted. The 2D simulation carried out by using the Kane's interband tunneling model. As doping profile is high band bending narrowing model is included. In both n-channel mode of operation and p-channel mode of operation conduction takes place by tunneling of electron from valance band of source to conduction band of drain region. Band to band tunneling is a strong function of electric field. Probability of tunneling becomes very significant when tunneling width reduces less than 10 nm. The simulated conduction band (E <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">C</sub> ) and valance band (E <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">V</sub> ) along the interface of Si-SiO <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sub> , under various bias conditions. As VGS increases from 0-0.8 V band bending becomes significant and further tunnel width decreases as VDS is applied. In the regime of 100 nm channel length and 2 nm oxide thicknesses, the input characteristic of n-channel DGTFET. In the off state (V <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">GS</sub> <;0.2 V), current flows very low (<;10 <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">-12</sup> Amp/μm) and then tunneling current increases very sharply. From the input characteristic we can say that DGTFET is almost free from drain induced barrier lowering problem. After channel length scaling, OFF-current increases and there is no significant increase of ON-current is seen. But it shows the potential that up to 40 nm of channel length, OFF-current is acceptable according to ITRS requirement. DGTFET gets saturated at very low voltage of VDS (~ 0.2 V), as shown in output characteristic. Therefore leads to zero output conductance. The input characteristic of p-channel tunnel FET is shown. But in p-channel mode of operation sufficient band bending takes place at higher gate and drain voltage. As the channel is formed by holes, tunneling driving current is less compare to n-channel TFET. The ON-current can be improved by careful choice of dielectric material. It can be seen that by high dielectric constant material (like HfO <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sub> ) ON-current improves by two orders of magnitude. In n-channel operation threshold voltage V <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">T</sub> is 0.625 V (at 10 <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">-7</sup> Amp/μm), which is calculated by constant current method from the input characteristic. Very low point subthreshold swing (~ 28 mv/dec) is observed and because of that high I <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">ON</sub> / I <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">OFF</sub> ratio (~10 <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">11</sup> ) is seen, which is useful to operate the device in low voltage range. In all low subthreshold swing, high I <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">ON</sub> / I <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">OFF</sub> ratio and low V <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">T</sub> make this device a strong candidate for ultralow power and ultralow voltage application.

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