Downshifting Encapsulant: Optical Simulation Evaluation of the Solution to Ultraviolet‐Induced Degradation in Silicon Heterojunction Solar Cells

Abstract

Ultraviolet (UV)‐induced degradation (UVID) poses a significant challenge for the prospective mass production of silicon heterojunction (SHJ) solar cells, known for their high efficiency. In this study, the magnified impact of UV radiation when employing a silicon carbide (SiC)‐based transparent passivating contact (TPC) on the front side of SHJ solar cells is reported. A reduction in open‐circuit voltage (VOC), short‐circuit current (JSC), and fill factor of 12%, 6%, and 11%, respectively, is observed after UV exposure. Conventional UVID mitigation measures, UV‐blocking encapsulation, are assessed through single‐cell TPC laminates, revealing an unavoidable tradeoff between current loss and UVID. Alternatively, the utilization of ultraviolet‐downshifting (UV‐DS) encapsulants is proposed to convert UV radiation into the visible light spectrum. An optical simulation method, conducted via OPAL2, is presented to evaluate UV‐DS encapsulants for diminishing UVID in SHJ solar cells with different front contacts. A simple methodology is proposed to mimic the optical property of UV‐DS encapsulants. In the simulation results, additional current gains of up to 0.33 mA cm−2 achievable with suitable UV‐DS encapsulants are highlighted. The factors related to the UV‐DS effects are evaluated and the optimization pathway for UV‐DS encapsulants is elucidated.