Abstract

The incubation time (ti) for the onset of porous Si formation by stain etching in HF:HNO3:H2O was observed to be a strong function of dopant type and concentration. For B-doped p-Si, ti increased significantly with substrate resistivity (ρ), from ∼0.5 min for 0.004 Ω cm to ∼9 min for 50 Ω cm. P-doped n-Si substrates exhibited a ti which decreased with increasing ρ, from ∼10 min for 0.15 Ω cm to ∼8 min for 20 Ω cm. We have utilized the difference in ti between n- and p-type Si to produce selective area photoluminescence (PL) by Ga+ focused ion beam (FIB) implantation doping and B+ broad beam implantation doping of n-type Si. Using 30 kV FIB Ga+ implantation, PL patterns with submicrometer resolution have been obtained for the first time.

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