Abstract
The Bi-43%Sn eutectic solder alloy is a candidate for lead-free replacement of the widely used Pb-Sn solders. The alloy exhibits a microstructural instability at elevated service temperatures causing extensive coarsening and nonuniformity in microstructure and severe creep deformation. The addition of insoluble dispersoid particles using a novel magnetic distribution technique has been found to significantly reduce the coarsening and the onset of tertiary creep. With improved microstuctural stability, the useful service range of the Bi-Sn eutectic solder can be raised to a higher homologous temperature.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
