Abstract

A novel etching technique using vaporized KOH to reveal various types of dislocations from the C-face of 4H-SiC has been proposed. Three different pit geometries have been observed, which can be attributed to three dislocation types commonly found in 4H-SiC. Pit positions on the Si-face and C-face have been compared to study the dislocation propagation behaviors across the sample thickness. Activation energy EA=49 kcal/mol has been obtained, indicating a surface-reaction-dominant process. This etching technique has provided an effective and inexpensive method of making inch-scale mapping of dislocation distribution for C-face epitaxial and bulky 4H-SiC.

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