Abstract

In this paper, we report a newly developed dislocation-revealing etch pit method for 4H-SiC single crystal, which can distinguish edge (TED, Burgers vector b=a), elementary screw (TSD, b=1c) and mixed (TMD, b=c+a) threading dislocations. In this method, vaporized NaOH gas was used to etch the Si-face of a SiC wafer at substrate temperature around 950 °C. By a side-by-side comparison between the optical images of the etch pits and the X-ray topographic (XRT) images, it has been found that threading dislocations (TDs) in SiC could be revealed as hexagonal etch pits with distinct geometrical features (shape, size and facet orientation) depending on their Burgers vectors. Based on these results, we consider this etch pit method as an easily-operated and inexpensive technique to categorize TDs, and it may help to promote our understanding on the different roles that these types of TDs have played in the performance degradation of SiC power devices.

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