Abstract
Laser shock peening (LSP) is an innovative surface processing technique. Grain refinement induced by LSP has been proved to be feasible to improve the surface properties of materials and prolong the service life of metallic components. The three-dimensional finite element model, which incorporates a dislocation density-based constitutive model and the temporal-spatial distribution of laser shock wave, was adopted to simulate the process of grain refinement induced by LSP. The predicted dislocation cell sizes, dimple fabrications induced by the repetitive LSP of copper are in good agreement with experimental results, which confirms the validity of the dislocation density-based three-dimensional finite element model. The effects of laser spot overlap ratio and laser power density (peak laser shock wave pressure) on LSP-induced grain refinement were investigated in detail based on the numerical simulations of multiple LSP of copper and CP-Ti.
Published Version
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a call