Abstract
We experimentally quantified, for the first time, the random dopant distribution (RDD)-induced threshold voltage standard deviation up to 40 mV for 20-nm-gate planar complementary metal-oxide-semiconductor (CMOS) field-effect transistors. Discrete dopants have been statistically positioned in the 3-D channel region to examine the associated carrier transportation characteristics, concurrently capturing ldquodopant concentration variationrdquo and ldquodopant position fluctuation.rdquo As the gate length further scales down to 15 nm, the newly developed discrete dopant scheme features an effective solution to suppress the 3-sigma-edge single-digit dopant-induced variation by the gate work function modulation. The results of this paper may postpone the scaling limit projected for planar CMOS.
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