Abstract

Ultraviolet (UV) photolithography is utilised to obtain required geometric features on a substrate coated with photosensitive polymer by impinging beam of UV light. Using this fabrication technique, dimensions in the order of sub-micron range can be achieved effectively. However, the conventional photolithography is quite complex, tardy and inefficient approach, specially to achieve higher dimensions (>50 µm). In this work, optimization for fabrication of microchannels using a custom PC based UV (405 nm) Direct Laser Writing (DLW) system for photolithography has been performed. Liquid photoresist and dry film photoresist of various thicknesses are used on the substrate and the patterns are fabricated using the DLW system. The geometry of developed pattern is observed using profilometry and imaging techniques to understand how the width and depth of pattern is being affected by the varying parameters (laser intensity and stage speed), and their optimal values for desired width and depth have been identified. Parameters for developing (developer solution and time) are analysed for both types of photoresists and their effect of mould dimensions have also been studied.

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