Abstract
Electromigration-induced resistance behavior of via-terminated metal lines was studied. We found a strong correlation between void morphology and step-like resistance behavior. For the lines which exhibit pronounced resistance steps, voids are formed at the top or bottom Al/TiN interface. For the lines which exhibit gradual resistance increases, only complete void formation severing the whole line occurs. The step-like resistance behavior is more pronounced when the current density is close to the critical current density. Possible mechanisms for the resistance steps are discussed.
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