Abstract
AbstractDevelopment of high‐precision RGB patterning process is needed to implement high‐resolution micro display (OLEDoS) for next‐generation VR/AR products. In general, specially designed and manufactured masks are required to realize above 3000‐ppi high‐resolution display in structured OLED material deposition. In this study, we developed direct laser patterning IR‐fs optical system operating in MHz and GHz burst modes and evaluated its capability for precise micro‐drilling of aluminoborosilicate glass materials. The fine hole‐shaped pattern is produced at a minimum of 5 μm pitch level for about 0.6 in. area without sacrificing the glass strength. It is expected to contribute to the high precise manufacture of ultra fine mask (UFM) using thin glass platform corresponding to micro displays in the future.
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