Direct-Ink-Writing Printed Strain Rosette Sensor Array with Optimized Circuit Layout

Abstract

The full-field multiaxial strain measurement is highly desired for application of structural monitoring but still challenging, especially when the manufacturing and assembling for large-area sensing devices is quite difficult. Compared with the traditional procedure of gluing commercial strain gauges on the structure surfaces for strain monitoring, the recently developed Direct-Ink-Writing (DIW) technology provides a feasible way to directly print sensors on the structure. However, there are still crucial issues in the design and printing strategies to be probed and improved. Therefore, in this work, we propose an integrated strategy from layered circuit scheme to rapid manufacturing of strain rosette sensor array based on the DIW technology. Benefit from the innovative design with simplified circuit layout and the advantages of DIW for printing multilayer structures, here we achieve optimization design principle for strain rosette sensor array with scalable circuit layout, which enable a hierarchical printing strategy for multiaxial strain monitoring in large scale or multiple domains. The strategy is highly expected to adapt for the emerging requirement in various applications such as integrated soft electronics, nondestructive testing and small-batch medical devices.