Dimensional Effect of Non-Polar Resistive Random Access Memory (RRAM) for Low-Power Memory Application

Abstract

The relationships between the resistive cell dimension and the related analytical parameters such as the forming voltage, set voltage, and reset current were investigated to implement high-density and low-power unipolar RRAM. It was shown that the formation process in unipolar switching is strongly related to the cell dimension in the sub-nm region, not only in terms of its vertical thickness but also of its horizontal length, using the numerical simulation method. With the optimal cell size having sufficient initial resistance and a low forming voltage, the achievement of the greatest feasibility of the high-density low-power RRAM will be further accelerated. A numerical simulation was performed using a random circuit breaker (RCB) simulation model to investigate the optimal resistive switching condition. The on/off resistance ratio increases as the cell area decreases at the sub-nm level, and these phenomena are explained in terms of the relatively large set resistance change in a very small area due to the conductive defect (CD) amount effect in the RCB network model.