Abstract

AbstractThe paper presents glass as a potential material to advanced interposers for high-density three-dimensional (3-D) integration. Based on multi-bit through glass via (TGV) which comprises of vias filled with mixed carbon nanotube bundle (mCNTB) and separate metallic pads, the performance of differential multi-bit through glass vias (DM-TGCVs) is studied and analyzed. The effective complex conductivity of mCNTB is derived for computation of the high frequency behavior of DM-TGCVs. An equivalent circuit model of DM-TGCVs is then presented, with the effects of mean free path considered appropriately. The frequency dependent differential- and common-mode impedances are extracted up to 100 GHz through the partial-element-equivalent circuit technique. It is analyzed that DM-TGCVs exhibit superior performance than through silicon via counterparts in terms of improved insertion loss and reduced crosstalk. Using the proposed circuit model, characteristic impedance, and S-parameters of DM-TGCVs are exhaustively investigated for the various set of design parameters and verified by comparison with the full-wave electromagnetic simulations.KeywordsCarbon nanotubes (CNTs)Effective complex conductivitySignal transmissionThrough glass via (TGV)Partial-element equivalent-circuit

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