Dielectric thermally conductive and stable poly(arylene ether nitrile) composites filled with silver nanoparticles decorated hexagonal boron nitride

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Polymer composites with high thermal conductivity, low dielectric constant and low dielectric loss are very promising for electronic packaging. However, it is a big challenge to balance these parameters. Herein, we demonstrated the novel thermally conductive and stable silver nanoparticles decorated hexagonal boron nitride (h-BN/AgNPs)/poly(arylene ether nitrile) composites with low dielectric constant and low dielectric loss. To achieve these targets, h-BN was modified by polydopamine through mussel-inspired method, followed by attaching the silver nanoparticles onto h-BN surface. As-modified h-BN was incorporated into PEN matrix to prepare AgNPs/h-BN@ PEN composite films by solution casting method. Owing to the good dispersion of nanofiller and synergistic effect of AgNPs and h-BN, the resultant AgNPs/h-BN@PEN composite with 30wt% of AgNPs/h-BN exhibited high thermal conductivity of 0.921W/(mK). Furthermore, the relatively low dielectric constant (5.6) and dielectric loss (0.11) of PEN composites at 1kHz were achieved with the same loading content of AgNPs/h-BN. In addition, the thermal stability of PEN composites was greatly increased with the incorporation of AgNPs/h-BN. This work demonstrated that the thermally conductive and stable AgNPs/h-BN@PEN composites with low dielectric constant and low dielectric loss can be used as promising packaging materials in the area of electronic packaging.