Dielectric strength of voidless BaTiO3 films with nano-scale grains fabricated by aerosol deposition

Abstract

In order to investigate the dielectric strength properties of the BaTiO3 films with nano-scale grains with uniform grain size and no voids, BaTiO3 films were fabricated with a thickness of 1 μm by an AD process, and the fabricated films were sintered at 800, 900, and 1000 °C in air and reducing atmosphere. The films have superior dielectric strength properties due to their uniform grain size and high density without any voids. In addition, based on investigation of the leakage current (intrinsic) properties, it was confirmed that the sintering conditions of the reducing atmosphere largely increase leakage currents due to generated electrons and doubly ionized oxygen vacancies following the Poole-Frenkel emission mechanism, and increased leakage currents flow at grain boundary regions. Therefore, we conclude that the extrinsic breakdown factors should be eliminated for superior dielectric strength properties, and it is important to enhance grain boundaries by doping acceptors and rare-earth elements.