Abstract

Semiconductor materials based on metal high crosslinked-vinyl polymer composites were prepared through loading of Pd(OAc)2 on both Poly(ethylene-1,2-diyl dimethacrylate) (poly(EDMA)) and poly(ethylene-1,2-diyl dimethacrylate-co-methyl methacrylate) (Poly(EDMA-co-MMA)). The thermochemical properties for both poly(EDMA) and poly(EDMA-co-MMA) were investigated by thermal gravimetric analysis TGA technique. The dielectric permittivity, AC electrical conductivity and conduction mechanism for all the prepared polymers and their Pd(OAc)2 composites were studied. The results showed that the loading of polymers with Pd(OAc)2 led to an increase in the magnitudes of both the dielectric permittivity and AC electrical conductivity (σac). The value of σac increased from 1.38 × 10−5 to 5.84 × 10−5 S m−1 and from 6.40 × 10−6 to 2.48 × 10−5 S m−1 for poly(EDMA) and poly(EDMA-co-MMA), respectively, at 1 MHz and 340 K after loading with Pd(OAc)2. Additionally, all the prepared polymers and composites were considered as semiconductors at all the test frequencies and in the temperature range of 300–340 K. Furthermore, it seems that a conduction mechanism for all the samples could be Quantum Mechanical Tunneling (QMT).

Highlights

  • Polymers have attracted a lot of interest in the development of modern technologies due to their easy synthesis, cheaper cost, high stability, noncorrosive nature, and low density, which makes them suitable materials for replacing metals and ceramics [1,2]

  • Conclusions firmed as semiconductor materials based on the dependence of their σac on both the temperature and test frequency. poly(EDMA-co-methyl methacrylate (MMA))

  • Poly(EDMA-co-MMA), firmed as semiconductor materials based on the dependence of their σac on both the temrespectively

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Summary

Introduction

Polymers have attracted a lot of interest in the development of modern technologies due to their easy synthesis, cheaper cost, high stability, noncorrosive nature, and low density, which makes them suitable materials for replacing metals and ceramics [1,2].the electrical insulating nature of most polymers, their electrical conductivity σac in the range of 10−12 –10−16 S m−1 , has limited their technological and engineering applications. 102 –107 S m−1 , which can facilitate the movement of charge carriers through the electron hopping or tunneling process [3]. These functional filler materials include carbon-based nanomaterials, ceramics, metals, or metal oxides [4]. Semiconductors based on polymer composites with electrical properties close to metals and mechanical properties like plastics were produced [5,6,7]. These semiconductor composites can be applied in many

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