Die-cavity pocketing via cutting simulation

Abstract

For die-cavity pocketing, the cavity volume is sliced into a number of cutting-layers by horizontal cutting-planes, and each layer is pocket-machined using the contour-parallel offset method in which the tool-paths are obtained by repeatedly offsetting the boundary-pocketing curve. The major challenges in die-cavity pocketing include: 1) finding a method for obtaining the boundary-pocketing curve, 2) generating evenly spaced contour-parallel offset toolpaths, 3) detecting and removing uncut-regions, and 4) estimating chip-loads for an adaptive feed control. No systematic solution for these problems has been offered in the literature, except the curve offsetting methods for computing contour-parallel offset curves. Presented in the article is a straightforward approach to die-cavity pocketing, in which all the four challenges are handled successfully by using the existing cutting-simulation methods.