Abstract
The die attach related problems of lifting and die cracking become more critical with increasing size of integrated circuit (IC) devices. For this reason, a thermal test utilizing specialized chips and an automated system has been designed for the evaluation of large die attach integrity. Both void detection and statistical characterization of sample populations are possible. While an actual estimation of void size is not made, a quantitative evaluation by comparison is established. The correlation of test measurements with die attach related failures provides a useful tool for process evaluation. Examples of studies done with gold-silicon eutectic die attach are discussed.
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