Abstract
In this study, the surface topographies of chemical mechanical polishing (CMP) pad samples for varying levels of diamond microwear of a conditioner have been measured using a confocal microscope and an X-ray computer tomography (CT) scanner. The experimental results showed that the increase in the pad debris on the pad surface reduced the pad height ratio of the asperity called the “top surface area (TSA) ratio”. In addition, the overall removal rate in tungsten CMP was more dependent on the TSA ratio after polishing than on that after conditioning because the pad surface condition became worse with deformed asperities and micropores due to the insufficient conditioning.
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