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Abstract
Diamond/Ag-Ti composites were fabricated by pressureless sintering. The minor addition of Ti effectively ameliorated the wettability between diamond and the silver matrix. Transmission electron microscopy indicated that the interface structure of the diamond (100) plane of the diamond/Ag-Ti composites was Ag/TiC/TiC-Ag/diamond. The thermal conductivity of the 300 μm 60 vol% diamond/Ag-1.5 at% Ti composite reached 953 W/m·K – approximately 98% of the theoretical thermal conductivity calculated by the differential effective medium model in conjunction with the diffuse mismatch model. The composites possessed compatible coefficients of thermal expansion, and excellent thermal cycling performance under long-term operation and stringent joining packages condition. The excellent thermal properties and low cost of the diamond/Ag-Ti composites make them promising as thermal management materials in integrated electronic devices.
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