Development process of epoxy resin using nano-layered Boron Nitride to enhance the mechanical properties and thermal conductivity

Abstract

This research compounded nanoparticles with epoxy resin, measured the thermal conductivity (TC) enhancement, characterized the morphology of these composites, and investigated the mechanical properties (MP) of resulting composite films. The resulting in unique physiochemical properties originating from the mixed behavioral properties of the nanoparticles and epoxy into one unity by employed Boron Nitride (BN) as a secondary filler into the epoxy matrix (EM).BN is increasingly being employed as a secondary filler to enrich the characteristics of epoxy resin. Also, solving some of its drawbacks such as brittleness and low TC. This research analyzed epoxy-matrix composites applying BN as filler and J2000 hardener. Composites containing from 0.5 wt% up to 10 wt% of filler were fabricated by solution mixing. The filler was effectively dispersed within the matrix using the sonication method. The specimens were subjected to TC calculations, as well as morphological analysis and a tensile strength test. TC of the pure resin signifies approximately 132.3% increase concerning the composite containing 10 wt% of BN. Sonication evidences to be a competent technique in exfoliating the BN and assisting its dispersion in the EM. Furthermore, the addition of BN enhanced the host matrix's young's modulus and tensile strength, as well as improved ductility (due to the usage of the J2000 hardener), resulting in a flexible composite film.