Year-end Sale % OFF 
Abstract
We developed the reliable flip chip mounting structure of VCSELs without hermetic sealing to realize 14 Gbps transmission modules. Underfill resin is sometimes used to protect VCSELs when hermetic sealing is not applied. However, it was shown that cracks occur inside VCSELs if Young’s modulus of underfill resin is high. The cracks can be prevented if we avoid the arrangement of underfill resin of high Young’s modulus on the mesa parts of VCSELs. We considered two mounting methods to prevent this failure. The first method is to use underfill resin of low Young’s modulus. The other uses a structure where the air caps cover the mesa parts. We evaluated these methods and confirmed that the cracks do not occur in either case.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callMore From: Transactions of The Japan Institute of Electronics Packaging
Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
