Abstract
To improve the thickness distribution of quartz crystal wafer, we developed new machining process which utilizing an atmospheric pressure plasma. The thickness distribution was corrected by numerically controlled machining which scanning of the quartz crystal wafer to the localized highdensity plasma. In the result of performing the numerical control machining of an AT cut quartz crystal wafer, the thickness distribution in the area of 13.5 mm × 16.8 mm was substantially improved from 272 nm [peak to valley (p-v)] to 55 nm (p-v) within 330 s. Moreover, unwanted spurious mode of the resonance curve in the machined quartz crystal wafer was reduced.
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