Abstract
In this research work we have developed a spin coating system that has capability of holding wafer size of 1.5˝ with the help of vacuum pump. A control unit is provided for achieving the spin rate in range of 500-6000 rpm. An ac universal motor was used for rotating the vacuum chuck. The spin coater whole structure was firstly mechanically designed and then fabricated on rigid platform. Moreover in order to evaluate the performance of developed spin coating unit, polymer film of polyvinylidene difluoride (PVDF) were deposited on silicon substrate and corning glass slide. The thickness of film deposited by spin coating unit is found to be 15-95 μm. The prominent feature of this whole developed system is simplicity, ruggedness and easily adjustable spin rate. The developed spin coating system was successfully utilized for depositing films on various sizes of substrate and glass slides.
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