Abstract
A negative-working photosensitive polyimide (PI) precursor based on a low dielectric polyimide precursor having a low coefficient of thermal expansion (CTE) and 1, 4-dihydropyridine (DHP) as a photosensitive compound has been developed. Co-polyamic acid(Co-PAA)s were prepared by ring-opening polyaddition of aromatic dianhydrides with diamines. The dissolution behavior of Co-PAAs containing DHP after exposure was studied and it was found that the difference of dissolution rate between the exposed and unexposed parts was enough to get a high contrast due to the photochemical reaction of DHP in the polymer film. The cured Co- PI film at 380°C showed the low coefficient of thermal expansion of 20ppm and the low dielectric constant of 2.7 at 1MHz.
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