Abstract
As a numerical tool for examining the microstructural fracture behavior in the smart and intelligent materials, a finite element method with the interface element was developed and the applicability of this method was studied through the serial computations using virtual polycrystalline models. As the results assuming the influence of grain orientation on the grain boundary, it was found that the anisotropic mechanical property of grain boundary (interaction between opening and slipping deformations) would be a dominant factor of the fracture process. Also, by employing the theory of crystal plasticity for the mechanical property of grain, it was revealed that the stress concentrations caused by both the mismatch between neighbor grains and the slipping at grain boundary could be demonstrated by using this method.
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