Abstract
Because of its unique intermittent cutting and friction reversal characteristics, elliptical vibration cutting (EVC) has become the most promising method for machining of otherwise difficult-to-machine materials in recent years. However, some problems remain in the research towards development of EVC devices. In this paper, with the intention of solving the existing problems of EVC devices, a nonresonant-type EVC device that is driven by two parallel piezoelectric stacks is developed. After the principle of the device is introduced, the stiffness of the EVC device is calculated, and device simulations and experimental evaluations are performed. In addition, the performance of the EVC device is also tested. The experimental results show that the maximum strokes of the two directional mechanisms operating along the X- and Z-axes can reach 16.78 μm and 15.35 μm, respectively, and the motion resolutions in the X-axis and Z-axis directions both reach approximately 50 nm. Finally, a curved surface cutting experiment is carried out to verify the performance of the developed device.
Highlights
Following rapid developments in areas such as aerospace technology, nanotechnology and microelectronics, precision and ultraprecision machining methods have drawn the attention of many researchers
The main points of the two degrees-of-freedom Elliptical vibration cutting (EVC) device design include the design of the guide mechanism, selection and preloading of the piezoelectric stack, the overall device design, selection of the main parameters for the finite element analysis, and device size optimization
As shown in the figure, the motion resolution in the X-axis and Z-axis directions is of the order of tens of nanometers
Summary
Following rapid developments in areas such as aerospace technology, nanotechnology and microelectronics, precision and ultraprecision machining methods have drawn the attention of many researchers. The effects of EVC on the suppression of burrs and tool wear were studied using the improved device.[12,13] Shamoto et al studied a resonant three-dimensional elliptical vibration-assisted cutting device and performed surface machining experiments using this device.[14,15] the setup of the existing three-dimensional elliptical vibration-assisted device meant that the elliptical trajectory parameters (such as the elliptical motion frequency) were difficult to adjust, and it was not suitable for use in processing of a variety of different materials. Because of the limitations of the existing resonant EVC devices, the elliptical motion parameters cannot be adjusted arbitrarily These devices require auxiliary forced refrigeration devices to disperse excess heat, while closed loop process control is difficult to achieve, and the device movement precision is low.
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