Abstract
A new shredded pulp–plastic microsphere composite with modified starch binder which is applicable to the packaging of electronic equipment has been developed. This composite with a 3 wt% microsphere content has almost the same compressive stress at 50% compressive strain as that of (poly)styrene foam, which has a specific gravity of 0.025. A moulded sample of the above composites can be released from a mould after 1.5 minutes of steam heating, the same cycle time as that of styrene foam. © 1997 John Wiley & Sons, Ltd.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
