Abstract
A new pulp-plastic microsphere composite which is applicable to the packaging of electronic equipment has been developed. This composite with a 10wt. % microsphere content has a compressive stress 80% lower than a conventional pulp mold at 50% compressive strain, and has almost the same compressive stress as that of styrene foam, which has a specific gravity of 0.02. The composite has a low compressive stress because the microspheres have a low specific gravity (0.02), and a shock absorbing property and the voids are uniformly distributed. The new pulp mold is promising as a material to replace styrene foam.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
