Abstract
This paper describes the LIGA process using a 600-MeV superconducting compact synchrotron light source. Deep-etch X-ray lithography is conducted using a new resist and mask. The resist is composed of a copolymer of methyl methacrylate (MMA) and methacrylic acid (MAA). Its main benefit is its high sensitivity, which is one order of magnitude greater than that of polymethyl methacrylate (PMMA) conventionally used in the LIGA process. The mask is composed of a 2-μm-thick silicon nitride membrane with high transparency, supporting a 5-μm-thick tungsten absorber. Experimental results for deep-etch X-ray lithography, electroplating, and molding techniques are presented. A micro-ultrasonic transmitter obtained using these techniques is also described. The purpose of this study is the realization of low-cost microcomponents for a variety of industrial applications. © 1997 Scripta Technica, Inc. Electr Eng Jpn, 120(1): 40–48, 1997
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