Development of laser-based techniques for rapid prototyping of printed wiring boards

Abstract

For rapid prototyping and repair of printed wiring boards, direct laser patterning techniques of Cu are investigated. Laser direct writing techniques reported in the literature are compared and contrasted. The approach taken in this work is laser-induced Ag seeding of the substrate followed by subsequent electroless Cu plating. The Ag seeds were deposited on FR4 and Al2O3 substrates using 3rd harmonic Nd:YVO4 and CO2 laser beams. Laser-written Ag seeds were catalytic for electroless deposition of Cu. A minimum resistivity of 6 µΩ-cm was obtained.For rapid prototyping and repair of printed wiring boards, direct laser patterning techniques of Cu are investigated. Laser direct writing techniques reported in the literature are compared and contrasted. The approach taken in this work is laser-induced Ag seeding of the substrate followed by subsequent electroless Cu plating. The Ag seeds were deposited on FR4 and Al2O3 substrates using 3rd harmonic Nd:YVO4 and CO2 laser beams. Laser-written Ag seeds were catalytic for electroless deposition of Cu. A minimum resistivity of 6 µΩ-cm was obtained.