Abstract
We demonstrate the metallization of amino-terminated, cross-linked biphenylthiol self-assembled monolayers (SAMs) via Pd catalysed electroless deposition (ELD) of Cu. Angle resolved X-ray photoelectron spectroscopy and atomic force microscopy were used for characterization. Lateral cross-linking and generation of terminal amino groups are induced by irradiation with low energy electrons. The cross-linked SAM suppresses the ELD of Cu onto the Au substrate. By the immobilization of Pd atoms to the terminal amino groups, catalytic sites are created in cross-linked areas. These sites then facilitate the electroless deposition of Cu on top of the SAM.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.