Development of DPSS-laser-based ito patterning system for large-scale FPD’s

Abstract

The flat panel display (FPD) market has expanded rapidly. Panel manufacturers continue their efforts to improve the efficiency of their manufacturing. They have to consider global environmental concerns regarding panel production more than before. The laser patterning method, is thought to be one of processing methods, breaks through the limits of present manufacturing inefficiencies and solves environmental problems. Hitz Hitachi Zosen Co. and Takei electric industries Co., Ltd. have been developing various laser patterning equipment in FPDs, semiconductor substrate lines and so on. The features of product are: providing a clean and chemical-free manufacturing environment, a small footprint and low costs. These features are better than the conventional wet etching process. Particularly, the author describes an indium tin oxide (ITO) film laser patterning manufacturing process for color filter (CF) substrates. The process can selectively remove ITO films without damage of multi-layer film on glass substrate.The flat panel display (FPD) market has expanded rapidly. Panel manufacturers continue their efforts to improve the efficiency of their manufacturing. They have to consider global environmental concerns regarding panel production more than before. The laser patterning method, is thought to be one of processing methods, breaks through the limits of present manufacturing inefficiencies and solves environmental problems. Hitz Hitachi Zosen Co. and Takei electric industries Co., Ltd. have been developing various laser patterning equipment in FPDs, semiconductor substrate lines and so on. The features of product are: providing a clean and chemical-free manufacturing environment, a small footprint and low costs. These features are better than the conventional wet etching process. Particularly, the author describes an indium tin oxide (ITO) film laser patterning manufacturing process for color filter (CF) substrates. The process can selectively remove ITO films without damage of multi-layer film on glass substrate.