Abstract
Die-bonding film is widely applied for semiconductor package of electronic equipments. The die-bonding film based on epoxy resin/acrylic polymer system shows the higher flexibility to thermal stress during the heat cycle test compared with epoxy–matrix systems. In addition, properties of the film vary widely depending on the ratio of epoxy resin and acrylic polymer contents. To satisfy the target properties, novel material design method named weak conditioned combinatorial linear programming was developed.
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