Abstract
The development of Cu–Sn intermetallic compound (IMC) at the solder/Cu joint interface had been studied using two Pb-free solders, Sn–3.8Ag–0.7Cu and Sn–2Ag–0.8Cu–0.6Sb alloys. Meanwhile, 100Sn/Cu joint was applied for comparison. Both Pb-free solder joints were found with thinner Cu–Sn IMC layers at as-soldered state due to the slower dissolution rate of intermetallic compound into the liquid Pb-free solders during reflow and, consequently, slower growth rates of Cu–Sn IMC during the solid-state thermal aging at 125 °C, where Sn–2Ag–0.8Cu–0.6Sb solder joint gave the minimum value. Thermodynamic analysis showed that such phenomena could be attributed to the reduction of the driving force for Cu–Sn IMC formation due to the existence of Ag and Sb atoms.
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