Development of Belt-Type Microstructure Array Flexible Mold and Asymmetric Hot Roller Embossing Process Technology

Weng Weng

doi:10.3390/coatings9040274

Abstract

This study proposed the belt-type microstructure array flexible mold designed hot roller embossing process technology. An extrusion molding system was integrated with belt-type hot roller embossing process technology and, deriving the asymmetric principle as the basis of prediction, designed a belt-type microstructure array hot roller embossing process system. This study first focused on the design and manufacturing of a belt-type hot roller embossing process system (roll to belt-type). It then carried out system integration and testing, along with the film extrusion system, to fabrication microstructure array production. Hot embossing was used to replicate the array of the plastic micro lens as the microstructure mold. The original master mold was fabricated with micro electromechanical technology and the PC micro lens array as the microstructure (inner layer) film using the gas-assisted hot embossing technology. A microstructure composite belt and magnetic belt were produced on the hot roller embossing by an innovated coated casting technique. The forming accuracy of the belt-type microstructure array flexible mold hot roller embossing process and the prediction precision of numerically simulated forming were discussed. The proposed process technology is expected to effectively reduce the process cycle time with the advantages of being a fast and continuous process.

Highlights

In recent years, due to the vigorous development of the semiconductor industry and the continuous progress of high technology, commercialized testing instruments, optical communication products, and consumer electronics products are facing the trend of miniaturization, integration, and multifunctional development
The experimental results show that, after the alumina powders with weight different percentages were mixed and solidified, the mechanical properties were tested under the weight percentages were mixed and solidified, the mechanical properties were tested under tensile test speed of
This study developed the belt-type microstructure array hot roller embossing process technology

Summary

Introduction

Due to the vigorous development of the semiconductor industry and the continuous progress of high technology, commercialized testing instruments, optical communication products, and consumer electronics products are facing the trend of miniaturization, integration, and multifunctional development. It is difficult to develop general miniaturizing processes, due to high cost and difficult mass production. Due to the wide application of plastic polymer embossing and forming technology [4–6] in microstructure array components and vast market demands, two kinds of embossing and replicating form technology (plane type and roller type) are commonly used. Compared to the plane embossing technology, the roller type embossing technology [7–17] has the advantages of continuous mass production and shortened embossing duration. In 1997, Gale [18] used electroplating nickel mold technology to duplicate the extremely thin nickel mold, in order to achieve mass replication of the structure. The technology adopted a roller coated with nickel mold and roll-to-roll production concept [19–21]. During the rolling process, due to a too-fast rolling speed (roller speed), the parts touched by the Coatings 2019, 9, 274; doi:10.3390/coatings9040274 www.mdpi.com/journal/coatings

Methods

Discussion

Conclusion