Abstract
For use as a diaphragm in the environmental cell (E‐cell), boron oxide and boron carbon oxynitride films were successfully applied to a Cu mesh with o/73 μm holes using plasma enhanced chemical vapor deposition (PECVD). First, the holes of the Cu mesh were filled with triacetyl cellulose (TAC) solution to prepare for deposition of the boron oxide film, which was performed by PECVD using precursors of trimethyl borate (B(OCH3)3) and oxygen (O2) or nitrogen (N2). Finally, the TAC film was etched onto the Cu mesh with acetone. The applied films were characterized by X‐ray photoelectron spectroscopy and transmission electron microscopy at 200 kV. The films were amorphous and transparent in the 200 kV electron examination and no charge‐up phenomenon was observed.
Published Version
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