Development of a Fast and High Resolution X-Ray Imaging Sensor for In-Line Inspection of Tape Substrate

Abstract

In an automated tape substrate inspections, machine vision is widely adopted for high throughput and cost advantages. However, conventional methods are overly sensitive to foreign particles or have limitations in detecting three-dimensional defects such as top over-etched defect. Foreign particles such as dustsdo not affect the integrity of the final product and are often detected as defects during inspection. To complement vision inspection systems, a prototype fast and fine spatial resolution X-ray imaging sensor has been developed. This image sensor, based on an optoelectronic device – the microchannel plate (MCP), has a spatial resolution of 20 μm and functions at frame rate of 30 fps. X-ray imaging is appropriate as it is virtually transparent to dust particles and provides information regarding the thickness of the copper wire patterns.